Application Engineer I: Package and Interposer Design
C
Cadence Design Systems, Inc.
📍 Belo Horizonte, Brazil, Brazil
Job Description
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Cadence Design Systems is looking for a candidate to join the Silicon Package Board (SPB) team as a full time engineer focused on Advanced Packaging Design. If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.
The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set, working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies. Understanding of competitive technologies is a plus. Ability to understand schematic, layout, interposers, integrated components.
Job Description:
+ Helping customers to adopt and proliferate our packaging solutions
+ Conducting technical presentations, technica...
Cadence Design Systems is looking for a candidate to join the Silicon Package Board (SPB) team as a full time engineer focused on Advanced Packaging Design. If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.
The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set, working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies. Understanding of competitive technologies is a plus. Ability to understand schematic, layout, interposers, integrated components.
Job Description:
+ Helping customers to adopt and proliferate our packaging solutions
+ Conducting technical presentations, technica...