Job Description
Job Details:
Job Description:
Become a member of the Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team in Kulim as a laser development engineer leading the development and deployment of Intel's advanced chip packaging process technology.
- In this position, you will be responsible for developing laser marking, laser barrier, laser ablation and micro drilling next generation semiconductor packaging technology.
- Your responsibilities include, but are not limited to, development of laser process recipes and understanding material interactions while delivering to our quality and reliability standards.
- In addition, you will be engaging in testing and validating hardware/software upgrades to meet product requirements.
- Laser Development Engineers respond to customer requests or challenges, develop solutions to problems...