DIE attach module engineer
I
Intel Technology (m) Sdn Bhd
📍 Kulim, Kedah, Malaysia
Job Description
Looking for Semiconductor Assembly DIE Attached module engineer. location: Kulim
Minimum Qualifications:
Bachelor's degree in Materials/Mechanical/Chemical/Electrical Engineering or related field.
At least 2 years hands-on experience in die attach/TCB, flipchip, or semiconductor assembly process.
Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and finepitch alignment.
Proficiency in SPC and datadriven problem solving.
Experience with metrology analytics. ex: Xray, warpage measurement, optical inspection (AOI), microscopy.
Ability to work in Class 10k-100k cleanroom with PPE.
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Minimum Qualifications:
Bachelor's degree in Materials/Mechanical/Chemical/Electrical Engineering or related field.
At least 2 years hands-on experience in die attach/TCB, flipchip, or semiconductor assembly process.
Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and finepitch alignment.
Proficiency in SPC and datadriven problem solving.
Experience with metrology analytics. ex: Xray, warpage measurement, optical inspection (AOI), microscopy.
Ability to work in Class 10k-100k cleanroom with PPE.
Show more Show less