Die Attach & TCB Process Engineer - High-Volume Manufacturing
I
Intel
📍 Kulim, Kedah, Malaysia
Job Description
A global technology company seeks a candidate for a role focused on critical manufacturing equipment and processes for integrated circuits in Kulim, Malaysia. The ideal applicant will have a Bachelor's degree in Engineering and at least 2 years of hands-on experience in semiconductor assembly. Responsibilities include ensuring process control, optimizing production techniques, and conducting tests to maintain high standards in manufacturing. Onsite presence is mandatory for the position.
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