Direct Lid/Stiffener Attach Packaging Module Development Engineer

Intel Corporation

📍 kulim, kulim, Malaysia

Full-time Other-General Posted June 15, 2026

Job Description

Job Details: Job Description: The position is for Package Module Development Engineer for direct lid/stiffener attach module as part of ATD (Assembly Technology Development) in Asia initiative. The candidate will define and establish process flow, conduct FMEA assessment, procedures, drawings review and equipment configuration for NPI products. Selects and develops material and equipment (recipe, collaterals based on design rules) and drives improvement for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements over variables such as material, method, equipment, environment and operating personnel. Plans and conduct experiments to fully characterize the process throughout the development cycle. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Candidate will also participate in pathfinding activities including new TIM (thermal interface material) qualification with regards to ther...