Director, Power Packaging & High-Volume Assembly

Renesas Electronics is seeking a Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing. The role involves oversight of yield performance, process quality, and collaboration with cross-functional teams.

The ideal candidate will have deep semiconductor packaging expertise, strong operational leadership, and data-driven decision-making abilities. This position includes managing OSAT relationships and ensuring manufacturing readiness for new products.