Lead Wire Bond Equipment & Process Engineer

Nexperia in Seremban, Malaysia is seeking a Senior Wire Bond Equipment & Process Engineer to optimize semiconductor manufacturing processes. This role involves leading the setup and qualification of wire bonding equipment, collaborating with R&D and manufacturing teams, and implementing process improvements.

The ideal candidate has a Bachelor's degree in engineering, at least 5 years of experience in wire bonding, and strong analytical skills. Nexperia values diversity and offers a dynamic work environment.