Materials Development Engineer - Packaging & HVM Readiness

Intel is seeking an experienced individual in Penang, Malaysia, to lead materials technology development in packaging. The role requires a Ph.D. in a related field and a minimum of 5 years of materials development experience, particularly in packaging assembly.

The candidate will be responsible for developing and certifying materials, collaborating with various teams, and presenting strategies both internally and externally. Strong communication skills and project management capabilities are essential for success in this position.