Memory Packaging Technical Manager

Job DescriptionProduct 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM developmentRequirement1. >10yrs DRAM (LPDDR/HBM..) technical experience, RD is a plus. 2. Familiar with memory design, architecture, process, packaging, materials… 3. Project handling experience

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