Module Packaging Engineer – Thermal & Process Innovation

A leading semiconductor company located in Kulim, Malaysia is seeking an experienced engineer to develop and optimize assembly processes. This role requires a MSc or PhD in engineering coupled with a solid understanding of semiconductor assembly. Candidates will lead innovative solutions, ensure manufacturing efficiency, and maintain equipment for silicon technology evaluation. A minimum of 3 years of experience in relevant fields is required, and the position demands on-site presence to fulfill essential responsibilities.
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