Packaging Module Engineer - Direct Lid/Stiffener Attach

Intel is looking for a Package Module Development Engineer in Kulim, Malaysia. The role involves defining process flows, conducting FMEA assessments, and developing strategies for problem resolution in the manufacturing process.

Qualifications include a Bachelor’s or Master's degree in relevant fields, knowledge in statistical design of experiments, and preferred experience in semiconductor process development. The position emphasizes collaboration, training of engineers, and improvement of process efficiency.