Semiconductor Packaging and Test Lead

Roles: Manufacturing Lead- OSAT Packaging & Test

Experience: 5-15 Yrs

Location: Jagiroad, Assam.

Education Qualification: Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.

Job Description

• Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing.
• To Planning & execution of the Targeted manufacturing Volumes.
• Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines
• Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement
• Support NPI and technology transfers with equipment, materials, and process alignment
• Conduct root cause analysis and implement corrective actions for process de...