Semiconductor Packaging Process Lead

Roles: ISP Packaging Lead - OSAT Semiconductor

Experience: 10-15 Yrs

Education Qualification: Bachelor’s/Master’s in Mechanical, Electrical, or Electronics Engineering

Job Description

1. Experience in semiconductor packaging with hands-on experience in SMT and TLA line management
2. Oversee SMT and TLA line operations at OSAT sites, ensuring process stability, yield, and throughput targets
3. Coordinate with materials, and test engineering teams to define packaging architecture and assembly flow
4. Drive process optimization, equipment selection, and line readiness for NPI and high-volume production
5. Manage DFM reviews, BOM validation, and package reliability qualification
6. Interface with OSAT vendors for process audits, issue resolution, and continuous improvement initiatives.