Semiconductor Packaging Strategy & Assembly Lead

Nexperia in Seremban, Malaysia, is seeking an experienced leader to define and execute technology roadmaps in semiconductor packaging. You will drive the development of packaging solutions and coach a team to overcome technical challenges.

The ideal candidate should have at least 10 years in the semiconductor industry, including managerial experience. A comprehensive understanding of assembly processes and technology is crucial for this role, which promotes a culture of continuous learning and development.