Senior FOL Process Engineer (Wire Bond & Die Attach)

JOB RESPONSIBILITIES

• Responsible for sustaining & improving the Die Attach & Wire Bond Process
• Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for new products and regular production
• Monitor and maintain assembly yield within KPI target
• Key involvement in improving the systems to bring down scrap rate due to process excursions
• Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly
• Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target
• Support engineering initiatives in evaluating solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically
• Develop manufacturing work instructions and production routes along with...