Job Description
Job Responsibilities
- Responsible for sustaining & improving the Wire Bond Process
- Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for new products and regular production
- Monitor and maintain assembly yield within KPI target
- Key involvement in improving the systems to bring down scrap rate due to process excursions
- Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly
- Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target
- Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically
- Develop manufacturing work instructions and production routes along with engineering change o...