Job Description
Roles: ISP Packaging Lead - OSAT Semiconductor
Experience: 10-15 Yrs
Education Qualification: Bachelor’s/Master’s in Mechanical, Electrical, or Electronics Engineering
Job Description
- Experience in semiconductor packaging with hands-on experience in SMT and TLA line management
- Oversee SMT and TLA line operations at OSAT sites, ensuring process stability, yield, and throughput targets
- Coordinate with materials, and test engineering teams to define packaging architecture and assembly flow
- Drive process optimization, equipment selection, and line readiness for NPI and high-volume production
- Manage DFM reviews, BOM validation, and package reliability qualification
- Interface with OSAT vendors for process audits, issue resolution, and continuous improvement initiatives.