Job Description
Description
Job DescriptionResponsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints. Primarily Wirebond, Die Bond & Mold processes.Responsible for Developing new assembly technologies such as:Hybrid Wire Bonding (Al Heavy & Fine Wire Ultrasonic Bonding combined with Cu/PCC & Au Heavy Wire Bonding), Ribbon Bonding.Stacked Dice & Bridged Die Bonding on Leadframe Pad and DBC, Clip BondingHigh CTI, high Thermal, Low Stress Vacuum assisted Molding TechnologiesResponsible for defining package design rules, process flow and material set for new products including automotive power module packagesDrive alignment between GaN Power Discrete design requirements and supplier capabilities, to enable new product development and volume manufacturing of GaN Power Discrete productsRun p...