Die Attach Process Engineer Optimize Innovate Jobs in Malaysia
ethical AI opportunities in Malaysia
Ethical AI Jobs Found
Die Attach Process Engineer: Optimize & Innovate
🏢 STMicroelectronics · 📍 Muar, Johor, Malaysia
Senior Process and Equipment Manager - FOL Semicon
🏢 Hays · 📍 malaysia, malaysia, Malaysia
Process Engineer (Die Attach)
🏢 Michael Page · 📍 Selangor, Malaysia, Selangor, Malaysia
FOL Process Development Senior Staff Engineer
🏢 Osram (Malaysia) Sdn Bhd · 📍 Bayan Lepas, Pulau Pinang, Malaysia
Die Attach Process Engineer: From NPI to Mass Production
🏢 Michael Page · 📍 Selangor, Malaysia, Selangor, Malaysia
Senior Process Engineer: Die Attach & Wire Bond Innovation
🏢 ams OSRAM · 📍 Bayan Lepas, Penang, Malaysia
Senior FOL Process Engineer — Die Attach & Wire Bond
🏢 Ams Osram · 📍 Bayan Lepas, Penang, Malaysia
Engineer Unit Process Engineering Die Attach
🏢 Infineon Technologies · 📍 Malaysia, Malaysia, Malaysia
Process Development Senior Staff Engineer
🏢 OSRAM Opto Semiconductors (Malaysia) Sdn Bhd · 📍 Bayan Lepas, Pulau Pinang, Malaysia
Process Development Senior Staff Engineer (Die Attach/Wire Bond)
🏢 ams OSRAM · 📍 Bayan Lepas, Penang, Malaysia
Die Attach Equipment Technician
🏢 NXP Semiconductors · 📍 Kuala Lumpur, Kuala Lumpur, Malaysia
Die Attach Equipment Technician
🏢 NXP Semiconductors · 📍 Kuala Lumpur, Kuala Lumpur, Malaysia
DIE attach module engineer
🏢 Intel Technology (m) Sdn Bhd · 📍 Kulim, Kedah, Malaysia
DIE attach module engineer
🏢 Intel Technology (m) Sdn Bhd · 📍 Kulim, Kedah, Malaysia
Senior Die Attach & Wire Bond Process Engineer – Onsite
🏢 Coherent Corp. · 📍 Ipoh, Perak, Malaysia
Senior FOL Process Engineer: Yield & Process Optimization
🏢 ADI Resourcing · 📍 Seberang Perai, Penang, Malaysia
Senior Die Attach Process Development Engineer
🏢 Infineon Technologies · 📍 Malacca City, Malacca, Malaysia
Process Engineer
🏢 Michael Page International (Malaysia) Sdn Bhd · 📍 Teluk Panglima Garang, Selangor, Malaysia
QMT Central Materials Engineering Manager
🏢 STMicroelectronics · 📍 Muar, Johor, Malaysia
Senior Die Bond Equipment Lead | Process Optimization
🏢 Nexperia · 📍 Seremban, Negeri Sembilan, Malaysia
Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Staff Engineer Unit Process Development Die Attach
🏢 Infineon Technologies · 📍 Malaysia, Malaysia, Malaysia
Senior Staff Engineer Process Development Die Attach
🏢 Infineon Technologies · 📍 Malaysia, Malaysia, Malaysia
Engineer Unit Process Engineering Die Attach
🏢 Infineon Technologies · 📍 Melaka, Melaka, Malaysia
Senior Process Engineer - Innovate & Optimize
🏢 Cardinal Health · 📍 Kangar, Perlis, Malaysia
Manufacturing Process Engineer: Innovate & Optimize
🏢 Celestica · 📍 Kulim, Kedah, Malaysia
Engineer
🏢 NationGate Solution (M) Sdn. Bhd. · 📍 Butterworth, Pulau Pinang, Malaysia
Assistant Engineer Sustaining
🏢 Infineon Technologies · 📍 Malaysia, Malaysia, Malaysia
Die Attach Equipment Technician — Semiconductor Assembly Expert
🏢 NXP Semiconductors · 📍 Kuala Lumpur, Kuala Lumpur, Malaysia
Process Technician
🏢 TF AMD MICROELECTRONICS (PENANG) SDN. BHD. · 📍 Bayan Lepas, Pulau Pinang, Malaysia
QMT Central Materials Engineering Manager
🏢 STMicroelectronics · 📍 Muar, Johor, Malaysia
Associate Engineer - Process (Wire Bond & Die Attach)
🏢 Coherent Corp. · 📍 Ipoh, Perak, Malaysia
Equipment Technician
🏢 TF AMD MICROELECTRONICS (PENANG) SDN. BHD. · 📍 Batu Kawan, Pulau Pinang, Malaysia
Staff Engineer Maintenance Die Attach
🏢 Infineon Technologies · 📍 Malaysia, Malaysia, Malaysia
Staff Engineer Maintenance Die Attach
🏢 Infineon Technologies · 📍 Malaysia, Malaysia, Malaysia
Senior Die Bond Equipment
🏢 Nexperia Germany GmbH · 📍 Seremban, Negeri Sembilan, Malaysia
R&D Process Design Engineer
🏢 Coherent Malaysia Sdn Bhd · 📍 Tasek Gelugor, Pulau Pinang, Malaysia
R&D Process Design Engineer (Gelugor)
🏢 Coherent · 📍 Tasek Gelugor, Penang, Malaysia