Module Packaging Engineer Thermal Process Innovation Jobs in Kulim
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Module Packaging Engineer – Thermal & Process Innovation
🏢 Intel · 📍 Kulim, Kedah, Malaysia
Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Onsite Packaging Module Engineer – Lid & Stiffener
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Direct Lid/Stiffener Attach Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Direct Lid/Stiffener Attach Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Senior SMT Packaging & PCB Module Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Assembly Laser Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Mechanical Design Engineer: Prototyping & Thermal Systems
🏢 Watlow · 📍 Kulim, Kedah, Malaysia
Module Equipment Technician (Contract)
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Assembly Laser Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia