Module Packaging Engineer Thermal Process Innovation Jobs in Malaysia
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Module Packaging Engineer – Thermal & Process Innovation
🏢 Intel · 📍 Kulim, Kedah, Malaysia
Packaging Module Engineer: SMT & PCB Innovation
🏢 Intel Corporation · 📍 Malaysia, , , Malaysia, Malaysia
CUF TD Module Engineer
🏢 Intel Corporation · 📍 Malaysia, , , Malaysia, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Malaysia, , , Malaysia, Malaysia
PC System Thermal Applications Staff Engineer
🏢 Advanced Micro Devices · 📍 Penang, Malaysia, Penang, Malaysia
Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
PC System Thermal Applications Staff Engineer
🏢 Advanced Micro Devices, Inc · 📍 George Town, Penang, Malaysia
Senior Process Engineer
🏢 SANMINA-SCI SYSTEMS (MALAYSIA) SDN BHD · 📍 Butterworth, Pulau Pinang, Malaysia
PC System Thermal Applications Staff Engineer
🏢 AMD · 📍 George Town, Penang, Malaysia
Thermal Module Engineer
🏢 Asgard Resources Sdn Bhd · 📍 Kuala Lumpur, Kuala Lumpur, Malaysia
Principal Product Engineer – High Power Module
🏢 Onsemi · 📍 Seremban, Negeri Sembilan, Malaysia
Principal Product Engineer – High Power Module
🏢 onsemi · 📍 Seremban, Negeri Sembilan, Malaysia
Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
Principal Product Engineer – High Power Module
🏢 onsemi · 📍 Seremban, Negeri Sembilan, Malaysia
Principal Product Engineer – High Power Module
🏢 Onsemi · 📍 Seremban, Negeri Sembilan, Malaysia
PC System Thermal Applications Staff Engineer
🏢 AMD · 📍 George Town, Pulau Pinang, Malaysia
Manager, Process Module Engineering (Packaging Engineering)
🏢 SanDisk · 📍 Batu Kawan, Malaysia, Malaysia