Test Module Engineer Jobs in Kulim
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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Senior SMT Packaging & PCB Module Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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Die Attach & Thermal Bonding Process Engineer On-Site Kulim
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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Module Equipment Technician (Contract)
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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Direct Lid/Stiffener Attach Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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Direct Lid/Stiffener Attach Packaging Module Development Engineer
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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Onsite Packaging Module Engineer – Lid & Stiffener
🏢 Intel Corporation · 📍 Kulim, Kedah, Malaysia
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DIE attach module engineer
🏢 Intel Technology (m) Sdn Bhd · 📍 Kulim, Kedah, Malaysia
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DIE attach module engineer
🏢 Intel Technology (m) Sdn Bhd · 📍 Kulim, Kedah, Malaysia
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Staff Engineer IC Test Development
🏢 Infineon Technologies · 📍 Kulim, Kedah, Malaysia